Wafers for Automotive and other Key applications using Memories, embedded in Ulsi Processors

The WAKeMeUP project objective is to set-up a pilot line for advanced microcontrollers with embedded non-volatile memory, design and manufacturing for the prototyping of innovative applications for the smart mobility and smart society domains.

The project will target the industrialisation of the embedded Phase Change Memory (ePCM) technology built on top of the FDSOI 28nm logic process pilot line. The development of the ePCM will be driven by the final application requirements as well as decreasing the power consumption.

The already defined microcontrollers with 40nm embedded flash technology will be consolidated to build a solid manufacturing platform. Additional developments will be performed for the integration of memory, power management, connectivity, strong security on the same chip.

The alternative memory solutions will be also studied as they have different - and complementary - traits in such areas as read/write speed, power and energy consumption, retention and endurance, and device density and benchmarked with the ePCM and the conventional eFlash. Continued advances in materials, device physics, architectures and design could further reduce the energy consumption of these memories.

In the project, new devices and systems will be developed by the application partners in automotive and secure, based on FD-SOI and embedded digital technology, answering specific applications needs (power/performance/costs).

Please, do not hesitate to contact Jiri Kadlec for more information.

Project results

Project presentation

Acronym: WAKeMeUP
Title: Wafers for Automotive and other Key applications using Memories, embedded in Ulsi Processors
Project No.: 783176 (ECSEL)
8A18001 (MSMT)
Call: H2020-ECSEL-2017-1-IA-two-stage
web: http://www.wakemeup-ecsel.eu/
  • STMicroelectronics Crolles 2 SAS, France (coordinator)
  • GEMALTO SA, France
  • Commissariat a l Energie Atomique et aux energies alternatives (CEA-LETI), France
  • Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e. V. (FhG - IPMS), Germany
  • Technische Universität Darmstadt, Germany
  • Institute of Information Theory and Automation of the CAS, Czech Rep.
  • Institute of Microelectronic Applications, Czech Rep.
  • TUBITAK, Turkey
  • Universitat Autònoma de Barcelona, Spain
  • STMicroelectronics Rousset SAS, France
  • STMicroelectronics Grenoble 2 SAS, France
  • STMicroelectronics Grand Ouest SAS, France
  • Pfeiffer Vacuum, France
  • CRNS, Laboratoire des Technologies de la Microelectronique, France
  • STMicroelectronics SA, France
  • X-FAB Dresden GmbH & Co. KG, Germany
  • MELEXIS Erfurt GmbH, Germany
Duration: 1 May 2018 - 31 August 2021