THINGS2DO
THIN but Great Silicon 2 Design Objects

THINGS2DO is the ENIAC KET Pilot Line project addresses subprogram 3. Energy Efficiency, 6. Design technologies and 4. Health and Ageing Socity.

THINGS2DO project is focused on building the Design & Development Ecosystem for FD-SOI-technology. This technology is uniquely positioned to take advantage of some very distinct strengths of the European Semiconductor Industry. The baseline 28nm FD-SOI technology is available at an inflection point in the semiconductor progression path and offers unique features at this particular point in time. 14nm-FD-SOI will then take the technology's integration potential to unprecedented levels, utilizing the design/development ecosystem developed here.

Please, do not hesitate to contact Jiri Kadlec for more information.

Project results


Acronym: THINGS2DO
Name: THIN but Great Silicon 2 Design Objects
Project No.: ENIAC JU 621221
MSMT 7H14007
web: http://things2do.space.com.ro
Consortium: STMicroelectronics Grenoble, France (Project Coordinator)
STMicroelectronics SA, France
CEA LIST French Alternative Energies and Atomic Energy Commission, France
CEA LETI French Atomic Energy Commission, France
Design & Reuse, France
Mentor Graphics, France
Atrenta, France
Docea Power, France
Magillem Design Services, France
Asygn, France
Circuit Multi Projets, France
Cassidian, France
Dolphin Integration, France
Tiempo, France
TIMA Laboratory, France
Global Foundries, Germany
MunEDA, Germany
ZMDI, Germany
Ericsson, Turkey
Tubitak, Turkey
VTT, Finland
Warsaw University of Technology, Poland
ISD R&D Societe Anonyme S.A., Greece
Easii IC, France
University Politehnica of Bucharest, Romania
Institute of Information Theory and Automation of the AS CR, Czech Rep.
Institute of Microelectronics, Electromagnetism and Photonics, France
Science and Technology Facilities Council, UK
METAIO, Germany
DxO LAB, France
DxO-SIG, France
Dream Chip Technologies GmbH, Germany
EADS Deutschland GmbH, Germany
EADS France, France
Institute of Microelectronic Applications, Ltd., Czech Rep.
Institut National de l'Information Geographique et Forestiere, France
Instituto de Telecomunicaoes, Portugal
Fraunhofer Institute for Integrated Circuits IIS, Design Automation Division EAS, Germany
Fraunhofer Research Institution for Modular Solid-State Technologies EMFT, Germany
University of Tuebingen, Germany
Cadence, Germany
SORIN, France
M3 system, France
NXP Semiconductors, Belgium
IMS Bordeaux, France
Duration: 1 January 2014 - 31 December 2017

Presentations