TE0820, Vitis 2024.2 Second Life for TE Modules

Description

Main objective of this application note is description of steps required for a second life of the TE0820 module TE0820-03-04EV-1EA from:

  • The EECONE (Y1) modular system developed by UTIA for HW accelerated AI 3.2 inference on AMD DPU accelerator on the carrier board TE0701-06 with AMD Vitis/Vivado 2023.2.1 toolchain.

to

  • the "second life" as the EECONE (Y3) modular system demonstrating an ultrasound based hand distance measurement with HW accelerated adaptive recursive Lattice filter on UTIA SIMD Floating point HW accelerator on the reused TE0820 module TE0820-03-04EV-1EA on the carrier board TE0703-07 with AMD Vitis Classic 2024.2. toolchain.

The evaluation package provides precompiled SD card images containing integrated evaluation version of the UTIA FP32 SIMD HW accelerator with SW projects for the Arm A53 PS in source code with XRT SW API and OPEN CL SW api for these two targets:

Package Summary

Title TE0820, Vitis 2024.2 Second Life for TE Modules
Filenames te0820_114_240.zip (707 MB)
te0820_023_240.zip (732 MB)
185s_2x_fp23d4f2u_2f_v2_ocl_sw_install.zip (44,2 MB)
185s_2x_fp23d4f2u_2f_v2_xrt_sw_install.zip (30,5 MB)
TE0808_2024_2_rev08.pdf (2,8 MB)
License See application note for licensing conditions.
Package content ZIP archives with support files as described in application note.
Size te0820_114_240 ZIP file: 742 198 958 Bytes
te0820_023_240 ZIP file: 768 322 047 Bytes
185s_2x_fp23d4f2u_2f_v2_ocl_sw_install ZIP file: 46 443 806 Bytes
185s_2x_fp23d4f2u_2f_v2_xrt_sw_install ZIP file: 32 065 491 Bytes
PDF file: 2 940 277 Bytes
Required tools
& platform
AMD Vitis 2024.2
Installation notes See application note

Result Category

Project number Project acronym Year RIV category Comment
9A23008 EECONE 2026 Gfunk Functional sample (demo)

Contact Person

Please, do not hesitate to contact Jiri Kadlec to obtain more information.